High-frequency ultrasonic cleaning treatment system
Removes particles as small as 0.1μm! For cleaning semiconductor wafers and more.
This product is a high-frequency ultrasonic cleaning processing system that removes dust from fine uneven surfaces using ultrasonic waves. It can be used for cleaning semiconductor wafers, masks, and more. We offer a lineup of nozzle injection type, immersion type, and other cleaning processing systems. 【Features】 ■ Removes dust from fine uneven surfaces using ultrasonic waves ■ Equipped with transducers ranging from 400kHz to 5MHz ■ Removes particles as small as 0.1μm ■ Lineup includes nozzle injection type and immersion type *For more details, please refer to the PDF document or feel free to contact us.
- Company：光進電気工業 自然計測ディビジョン
- Price：Other
